Sun SPARC Enterprise T5240

Sun SPARC Enterprise T5240

System Board:

341-4139 PCI Filler Panel, RoHS:Y

541-2528 6-Core 1.2GHz Motherboard Assembly, RoHS:Y

330-4793 Memory Mezzanine Slot Filler, RoHS:Y

371-2210 CR2032 3V Battery, RoHS:Y

525-2344 System Configuration PROM, RoHS:Y

541-2523 System Board Tray, RoHS:Y



541-2529 8-Core 1.2GHz Motherboard Assembly, RoHS:Y

330-4793 Memory Mezzanine Slot Filler, RoHS:Y

371-2210 CR2032 3V Battery, RoHS:Y

525-2344 System Configuration PROM, RoHS:Y

541-2523 System Board Tray, RoHS:Y



541-2530 8-Core 1.4GHz Motherboard Assembly, RoHS:Y

330-4793 Memory Mezzanine Slot Filler, RoHS:Y

371-2210 CR2032 3V Battery, RoHS:Y

525-2344 System Configuration PROM, RoHS:Y

541-2523 System Board Tray, RoHS:Y



541-2931 4-Core 1.2GHz Motherboard Assembly, RoHS:Y

330-4793 Memory Mezzanine Slot Filler, RoHS:Y

371-2210 CR2032 3V Battery, RoHS:Y

525-2344 System Configuration PROM, RoHS:Y

541-2523 System Board Tray, RoHS:Y



内存：

SESX2A1Z 2GB Memory Expansion (2 × 1GB) X-Option, RoHS:Y

501-7952 1GB

SESX2A3Z 511-1150 2GB

SESX2B1Z 4GB Memory Expansion (2 × 2GB) X-Option, RoHS:Y

501-7953 2GB

SESX2B3Z 4GB Memory Expansion (2 × 2GB) X-Option, RoHS:Y

511-1151 4GB

SESX2C1Z 8GB Memory Expansion (2 × 4GB) X-Option, RoHS:Y

501-7954 4GB

SESX2C3Z 511-1152 8GB (2 × 4GB 1.55V FBDIMM), RoHS:Y

SESX2D3Z 511-1228 16GB (2 × 8GB 1.55V FBDIMM), RoHS:Y

SESX2B2Z 4GB Memory Expansion (2 × 2GB) X-Option, RoHS:Y

511-1161 2GB DDR2-667/PC2-5300 FBDIMM, RoHS:Y

371-4139 2GB DDR2-667/PC2-5300 1.5V DIMM

371-2145 2GB DDR2-667/PC2-5300 DIMM, RoHS:Y

371-4140 4GB DDR2-667/PC2-5300 1.5V DIMM

SEUX2MM2Z 594-4996 内存扩展板

SEUX2MM1Z 594-5205 内存扩展板





IO:

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